The properties, application processing and Prospect of epoxy-based negative photoresist SU-8 环氧基紫外负性光刻胶的特性、应用工艺与展望
SU-8 is a negative, epoxy type, near-UV photoresist. SU-8胶是一种负性、环氧树脂型、近紫外线光刻胶。
In chapter 2., the technology for fabricating microstructure using SU-8 negative photoresist by using UV lithography was optimized. MicroChannel with high depth has been fabricated on SU-8 photoresist layer. 第二章研究了SU-8光胶的光刻工艺,并对光刻工艺中的参数进行了优化,制得了深度较大的SU-8微通道。
This paper introduces a technical method of etching optical dividing disc with 302~# negative type photoresist. 本文介绍了采用302负性光刻胶刻制光学度盘的工艺方法。
Fabrication of micro-structure by using epoxy-based negative photoresist 环氧基负性光刻胶加工微结构的试验研究
Preparation of water based negative chemical amplified photoresist with high glass transition temperature 高玻璃化温度化学增幅光致抗蚀剂的制备
In particular, this thesis selects a not commonly used kind of metal "indium" as the solder, and designs a single layer thick negative photoresist lift-off method and the specified reflow temperature curve aiming at the indium ball fabrication. 特别地,本文选用金属铟这种不常用的焊料完成焊接,并针对铟球的制备设计了单层厚负胶剥离方法和专用的回流温度曲线。